d a t a sh eet product speci?cation supersedes data of 1996 jun 10 2003 may 13 discrete semiconductors prll4001; prll4002 rectifiers b ook, halfpage m3d121
2003 may 13 2 philips semiconductors product speci?cation recti?ers prll4001; prll4002 features glass passivated high maximum operating temperature low leakage current excellent stability shipped in 8 mm embossed tape smallest surface mount rectifier outline. description cavity free cylindrical glass package through implotec ? (1) technology. (1) implotec is a trademark of philips. this package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. fig.1 simplified outline (sod87) and symbol. handbook, 4 columns mam061 ka limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min. max. unit v rrm repetitive peak reverse voltage prll4001 - 50 v prll4002 - 100 v v r continuous reverse voltage prll4001 - 50 v prll4002 - 100 v i f(av) average forward current averaged over any 20 ms period; t tp = 105 c - 1.60 a averaged over any 20 ms period; t amb =65 c; see fig.2 - 0.68 a i frm repetitive peak forward current - 10 a i fsm non-repetitive peak forward current half sinewave; 60 hz - 20 a t stg storage temperature - 65 +175 c t j junction temperature - 65 +175 c
2003 may 13 3 philips semiconductors product speci?cation recti?ers prll4001; prll4002 electrical characteristics t j =25 c unless otherwise speci?ed. thermal characteristics note 1. device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper 3 40 m m, see fig.4. for more information please refer to the general part of associated handbook . symbol parameter conditions max. unit v f forward voltage i f = 1 a; see fig.3 1.1 v v f(av) full-cycle average forward voltage i f(av) = 1 a 0.8 v i r reverse current v r =v rmax 10 m a v r =v rmax ; t amb = 100 c50 m a i r(av) full-cycle average reverse current v r =v rrmmax ; t amb =75 c30 m a symbol parameter conditions value unit r th j-tp thermal resistance from junction to tie-point 30 k/w r th j-a thermal resistance from junction to ambient note 1 150 k/w
2003 may 13 4 philips semiconductors product speci?cation recti?ers prll4001; prll4002 graphical data handbook, halfpage 0 200 0 mbh384 0.5 1.0 100 t amb ( c) i f(av) (a) fig.2 maximum average forward current as a function of ambient temperature. fig.3 forward current as a function of forward voltage; typical values. handbook, halfpage 1.5 0 0.5 i f (a) 10 - 1 1 10 mbh385 1 v f (v) (2) (1) (3) (1) t amb = 100 c. (2) t amb = 20 c. (3) t amb = - 50 c. fig.4 printed-circuit board for surface mounting. dimensions in mm. msb213 4.5 2.5 1.25 50 50
2003 may 13 5 philips semiconductors product speci?cation recti?ers prll4001; prll4002 package outline references outline version european projection issue date iec jedec eiaj sod87 100h03 99-03-31 99-06-04 hermetically sealed glass surface mounted package; implotec tm(1) technology; 2 connectors sod87 unit d mm 2.1 2.0 2.0 1.8 3.7 3.3 0.3 d1 h l dimensions (mm are the original dimensions) h d d 1 ll (2) 0 1 2 mm scale notes 1. implotec is a trademark of philips. 2. the marking indicates the cathode. ka
2003 may 13 6 philips semiconductors product speci?cation recti?ers prll4001; prll4002 data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. 3. for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. level data sheet status (1) product status (2)(3) definition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn). definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change notification (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 may 13 7 philips semiconductors product speci?cation recti?ers prll4001; prll4002 notes
? koninklijke philips electronics n.v. 2003 sca75 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands 613514/02/pp 8 date of release: 2003 may 13 document order number: 9397 750 11184
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